PCB Gold Plating

Different requirements need to be plated with different thicknesses of gold, of course, the thicker the cost is also higher, then PCB gold plating in the end to plating how thick it is, let's take a look!

Usually PCB factory gold plating thickness can be done between 0.1 to 1.5um thickness, which is able to guarantee the quality of the gold thickness.2 oz copper thickness in mm If a little thicker, the factory can do, but the quality is not very stable.

Simply put, the circuit board gold deposition is the use of chemical deposition methods, through the chemical redox reaction on the surface of the circuit board to produce a layer of metal plating. The advantage of the gold deposition process is that the deposition of color on the surface of the printed circuit is very stable, brightness is very good, the plating layer is very flat, weldability is very good.

Circuit board immersion gold thickness standard and gold thickness unit:

Gold thickness is usually all standard units for U "(Chinese pronunciation read" Mai ", uinch micro-inch abbreviation)

With the metric units of micro-calculation: 1 micron (um) = 39.37 micro inches (uinch, abbreviated u"), usually for the convenience of the customary 1:40 to convert.

First, the circuit board sinking gold (gold, chemical sinking gold) is usually standard requirements for:

Imperial units: 1-3U ", metric units: 0.025-0.075um (micron)

If there is no special requirements, the circuit board factory is considered to allow the gold thickness tolerance of + / - 20%, but some circuit board factory to reduce costs through the actual gold thickness will be 20% discount, such as the requirements of gold thickness of 1U "(no special request for the full 1U" or greater than or equal to 1U ") the actual production of gold thickness of a minimum of 0.8U".

Second, the circuit board gold plating (electroplating, electro-gold) is usually standard requirements:

Do for the pad surface treatment, do the whole board flash plating, the usual thickness of: 1-3U "specific with the description of the sinking gold.

Now to electroplated gold to do for the whole board surface treatment process is very little, because electroplated gold soldering is not as good as immersion gold (easy to appear on the gold surface does not tin).

Now electroplated gold is mostly used for gold finger processing (due to electroplated gold, hardness,plated through hole vs via resistance to insertion and removal), so that the gold finger quality assurance (resistance to insertion and removal) common requirements of 15u thick "reliable performance is guaranteed, 30U" high standard of high quality (large companies, brand-name products are basically required to this thickness).

Another special purpose, there are other gold-plated thickness, for example:

1, the pursuit of ultra-high performance and reliability and cost does not care about the aerospace, military and other requirements to 50U ".

2, only for the pursuit of low-cost performance as long as it can be used on the line earlier domestic low-priced computer memory sticks, network cards, graphics cards, etc. There is a requirement to do 1U "or so. (Early years have used some of the domestic relatively low-priced desktop computers at the time, whether in the computer after a year or two or so, even if you have never plugged the memory stick will not be able to power on, you need to pull out the memory stick will be gold finger wipe and then inserted in order to power on);.

3, of course, depending on the use of different products, the use of different environments, the gold finger inserted into different card slots, the pursuit of different product quality, different understanding of the cost, etc. can choose to request a different thickness of the gold finger gold-plated, the current circuit board plating thickness of 50U "within the control of the production process are relatively mature;

PCB gold-plated and gold-plated difference

PCB gold-immersed board

The so-called PCB gold-immersion process refers to the chemical redox reaction method to generate a layer of plating, the general thickness is thicker, is a chemical nickel gold layer deposition method, you can achieve a thicker layer of gold.

PCB Gold Plating

PCB gold plating is also known as "electroplated gold", "electroplated nickel gold plate", "electrolytic gold", "electro-gold", "electro-gold", "electro-nickel gold plate", "electro-nickel gold plate", "electro-nickel gold plate", "electro-nickel gold plate". "Electro-nickel gold plate", gold plating is divided into soft gold and hard gold two kinds of hard gold is used for gold finger circuit board products, the principle is that the nickel and gold (commonly known as gold salts) dissolved in chemical solution, the circuit board immersed in the plating cylinder and turn on the current in the circuit board on the surface of the copper foil to generate nickel-gold plating, electro-nickel gold plating due to the hardness of the layer is high, the more wear-resistant.

PCB gold immersion and gold-plated difference is what

1. immersion gold for the thickness of the gold is thicker than gold-plated, immersion gold plate was gold-colored than gold-plated more yellow, from the board immersion gold more customer satisfaction.

2. Immersion gold and gold plating formed by the crystal structure is not the same, immersion gold compared to gold plating in terms of easier welding, welding process is not easy to weld bad, in addition, immersion gold is softer than the gold plating, the production of gold finger circuit right board generally choose gold plating, hard